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Product Manuafacture
High Frequency Transistor
Ceramic Transistor Package We use
Part Number:

RF Transistor
2SC Series (Toshiba, MIT)
BLF Series (NXP, Philip)
D*UK/DMD Series (SemeLAB)
DU Series (MA-COM)
MS Series (Mircorsemi, APT)
VRF Series (Mircorsemi, APT)
Other Series
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Product Manuafacture

RF transistor production department

All the HG RF products are completed by our RF transistor production department, which mainly includes following procedure.
●  Chip test
●  Chip sintering
●  Chip bonding
●  Cap sealing
●  Finished product test

In order to ensure the reliability of our product, we mainly use the following technology in chip sintering procedure.
●  Gold antimony sintering
●  Gold silicon sintering
●  Gold Tin sintering
Sintering process utilizes a large number of gold alloys to equip our devices with high reliability in accordance with the European and American Environmental Protection Standard. We promise to produce 100% lead-free sintering.
R & D Department for Chips
Our company enjoys a full set of R & D capability for high-frequency chips. We can do product analysis, chip design, application analysis and CAD drawing, mask plate, and any required process.
We adopt sophisticated technology in chip production. Our side guarantees that the performance of our products can fully meet or exceed that of original part.
When chip production is completed, the bare chip testing and burn-in screening technology will be used, which is called chip level aging. We spent 48-hour full power to continuously pulse aging method in order to ensure the reliability of all of the radio frequency chips from our company.
The Following is our chip production process and an on-site photo.

Ceramic Package Production Department

We have a specific ceramic package production department. Combined with the technical of ceramic package production and CAD technology, we have greatly improved our productivity. The performance and dimension of ceramic package is close to foreign products. The Following is the package production equipments and a photo of the workshop.

WUXI Huago(HG) Semiconductor Co., Ltd.(無錫市華高微電子有限公司) Copyright 2016. All Rights Reserved(版權所有). ICP number(ICP 編號): 蘇ICP備11030609號
Address:6th Floor, 20# Building, 53 Xiuxi Rd, Binhu District, Wuxi, Jiangsu, China; Postcode: 214122
Tel: +86-510-81023902 +86-755-61285520  Fax:+86-510-81023909

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